ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,522, issued on Sept. 8, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Semiconductor devices methods of manufac... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,523, issued on Sept. 8, was assigned to InnoLux Corp. (Miao-Li County, Taiwan). "Electronic device and manufacturing method thereof" was in... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,524, issued on Sept. 8, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Electronic device" was invented by Ch... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,525, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.). "Build up material architecture for microelectronic package devi... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,526, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method" wa... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,527, issued on Sept. 8, was assigned to JMJ Korea Co. Ltd. (Busan, South Korea). "Apparatus for bonding clip, method of bonding clip, and s... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,528, issued on Sept. 8, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Manufacturing method for semiconductor device" was inven... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,529, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Bump structure and method of ma... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,530, issued on Sept. 8, was assigned to Nippon Micrometal Corp. (Saitama, Japan). "Bonding wire for semiconductor devices" was invented by ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,531, issued on Sept. 8, was assigned to Atotech Deutschland Gmbh & Co. KG (Berlin). "Method for copper-to-copper direct bonding and assembl... Read More